LG Electronics has signed an MOU with Flex, a global leader in data center infrastructure manufacturing, to co-develop modular cooling technologies for next-generation data centers. The collaboration combines LG’s air and liquid cooling systems such as CRAC, CRAH, chillers, and coolant distribution units—with Flex’s liquid cooling and power management solutions to meet growing thermal demands from AI-driven operations.
The partnership will help data center operators improve energy efficiency, scale faster, and customize systems based on workload needs. LG is expanding its global data center business with new projects in Indonesia, the Middle East, Africa, and North America. The company also completed a proof-of-concept with LG Uplus on advanced liquid cooling and plans to commercialize next-generation cooling systems later this year.
Jointly developed solutions will be part of the Flex AI infrastructure platform, integrating power, cooling, compute, and services into scalable modular designs. LG aims to strengthen its presence in the global data center market and support the infrastructure needed for the AI era.
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