LG Innotek has developed a new semiconductor substrate technology called Copper Post (Cu-Post), which it began mass-producing in early July. This new method is designed to improve the performance and size efficiency of components used in mobile devices, especially as demand grows for slimmer smartphones with more powerful chips.
Traditional semiconductor substrates connect to the mainboard using solder balls directly attached to the substrate. These balls need to be a certain size to maintain a stable connection, limiting how closely they can be placed. LG Innotek’s Cu-Post method changes this by placing the solder balls on copper posts first, which allows for smaller and denser arrangements. This change makes it possible to fit about 20% more solder balls, increasing the number of circuits and improving performance.
The copper posts also help with heat dissipation. Since copper has a much higher thermal conductivity than solder, it can release heat more effectively, reducing the risk of performance issues caused by overheating.
This technology helps shrink the overall size of the semiconductor while maintaining its capability. It’s especially useful for devices that require high processing power, such as smartphones running AI functions. LG Innotek has secured around 40 patents related to Cu-Post and plans to expand its use in other advanced semiconductor packages like RF-SiP and FC-CSP.
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