Nikon will start taking orders for its new Digital Lithography System DSP-100 in July 2025. Designed for the back-end of semiconductor manufacturing, the DSP-100 is developed specifically for advanced packaging, offering 1.0μm resolution and support for large square substrates up to 600×600mm. It’s aimed at panel-level packaging, which is gaining traction as demand grows for high-performance chips used in AI, IoT and data center applications.
The DSP-100 uses maskless lithography with a spatial light modulator (SLM), removing the need for photomasks and enabling more flexible and efficient production. This reduces development time, cost and complexity for manufacturers. Built on Nikon’s proven semiconductor lithography and flat panel display technologies, the system delivers both high resolution and productivity up to 50 panels per hour.
The system also supports warpage correction and uses solid-state light sources to reduce maintenance and support more sustainable production. Compared to traditional 300mm wafers, the system offers up to 9x higher productivity for 100mm-square packages.
The DSP-100 is expected to release commercially in FY26 and signals Nikon’s deeper involvement in next-gen semiconductor packaging solutions.
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