The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM) with a total investment of about ₹4,600 crore. These projects, proposed by SiCSem, Continental Device India Pvt. Ltd., 3D Glass Solutions, Inc. and Advanced System in Package (ASIP) Technologies are expected to create over 2,000 direct skilled jobs and many more indirectly. With this the total approved ISM projects rises to 10 involving investments of around ₹1.6 lakh crore across six states.
SiCSem and 3D Glass Solutions will set up units in Bhubaneswar, Odisha. SiCSem will establish India’s first commercial Silicon Carbide-based compound semiconductor fab, while 3D Glass Solutions will introduce advanced glass-based packaging technology. ASIP will set up a semiconductor unit in Andhra Pradesh in collaboration with a South Korean firm, and CDIL will expand its high-power semiconductor facility in Mohali, Punjab.
These facilities will serve sectors like defence, electric vehicles, renewable energy, telecom and high-performance computing.
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