Canon Inc announced the development and practical implementation of inkjet based adaptive planarization, a new wafer planarization technology for semiconductor manufacturing. Canon plans to commercialize equipment using this technology in 2027 for logic and memory device production.
Wafer planarization is required to smooth surface irregularities that occur as layers and wiring are added during chip fabrication. Existing methods such as spin coating and chemical mechanical polishing involve multiple steps which increase process complexity and cost.
Canon’s approach adapts its nanoimprint lithography expertise. An inkjet system dispenses light curable material onto the wafer based on surface topography. A flat glass plate is then pressed onto the wafer to level the surface in a single process. This method can planarize a 300 mm wafer and reduce surface irregularities to 5 nanometers or less.
The technology builds on Canon’s FPA 1200NZ2C system launched in 2023. Canon and Canon Nanotechnologies will present technical details and early results at the SPIE Advanced Lithography and Patterning Conference in February 2026.
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