LG Chem has completed the development of a liquid photo-imageable dielectric (PID), a material used in advanced semiconductor packaging. PID forms fine interconnects between chips and substrates, improving performance and reliability. The new liquid PID enables high-resolution patterning, cures at lower temperatures, and has low shrinkage and moisture absorption. It is also free of PFAS and harmful organic solvents, meeting stricter environmental standards.
In addition to liquid PID, LG Chem is accelerating the development of a film-type PID designed for large IC substrates. Unlike conventional liquid forms, the film version maintains uniform thickness on large panels, reduces cracking from thermal stress, and works with existing lamination equipment, simplifying adoption for manufacturers.
This move positions LG Chem to expand into AI and high-performance semiconductor markets, areas demanding more precise and durable packaging materials. The company is also collaborating with global semiconductor firms while continuing to develop other back-end packaging materials like copper-clad laminates, die attach films, non-conductive films and build-up films.
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