Collaboration with ROHM and Mitsubishi Electric Targets Scale in Power Devices
Toshiba Corporation has signed a memorandum of understanding to begin discussions on integrating its semiconductor business with ROHM Co., Ltd. and Mitsubishi Electric Corporation.
The proposed integration includes Toshiba Electronic Devices & Storage Corporation’s semiconductor operations, ROHM’s semiconductor business and Mitsubishi Electric’s power device business. The discussions are being conducted in collaboration with Japan Industrial Partners and TBJ Holdings.
The initiative comes as companies respond to increasing global competition in the semiconductor industry and growing demand for power devices. Toshiba and ROHM have already been exploring collaboration, including a joint proposal submitted in 2023 to support large-scale production of power devices under Japan’s semiconductor supply initiatives.
The potential integration aims to create a stronger technological and operational base to compete globally while supporting a broader customer base across industries.
At this stage, the agreement marks the start of discussions, with transaction details and structure yet to be finalized.
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