ASUS unveils Optimized Liquid Cooling Solutions and a strategic partner framework to address rising thermal and power demands in AI and high performance computing data centers.
The portfolio includes direct to chip cooling, in row CDU based systems and hybrid configurations. These solutions are designed for dense AI racks including NVIDIA Vera Rubin NVL72 based systems. ASUS states the approach helps reduce energy use, improve power usage effectiveness and support higher rack density.
The framework includes collaborations with infrastructure partners such as Schneider Electric and Vertiv along with component suppliers like Cooler Master.
ASUS also highlights deployment of a liquid cooled AI supercomputer at Taiwan’s National Center for High performance Computing, achieving a reported PUE of 1.18.
The company plans to showcase its cooling ecosystem at NVIDIA GTC 2026 in San Jose.
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