Samsung and AMD Expand Collaboration on AI Memory and Computing Technologies
Samsung Electronics and AMD have signed a memorandum of understanding to expand collaboration on AI memory and computing technologies.
The partnership focuses on supplying HBM4 memory for AMD Instinct MI455X GPUs and developing DDR5 solutions for next-generation AMD EPYC processors and the AMD Helios platform. These technologies aim to support AI workloads, including model training and inference, across data center environments.
Samsung’s HBM4 memory is based on its latest DRAM process and is designed to deliver high bandwidth and improved power efficiency. This will be integrated with AMD’s GPUs and CPUs to enhance system performance and scalability.
The collaboration also includes work on optimized DDR5 memory for 6th Gen AMD EPYC processors and potential foundry services for future AMD products.
By combining Samsung’s memory and manufacturing capabilities with AMD’s computing platforms, the companies aim to support development of AI infrastructure with improved efficiency and performance across the full computing stack.
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