Bosch Ultrasonic Chipsets Automotive Technology Improve Parking and ADAS Performance
Bosch has introduced a new generation of ultrasonic chipsets, TB193 and TB293, designed to improve close range sensing in vehicles. The chips process raw sensor signals directly, enabling more detailed data capture and better object detection.
This approach allows AI based parking and braking systems to better assess surroundings, including obstacles, surfaces and tight spaces. The chipset uses a dual chip design, where TB293 captures sensor data and TB193 processes and coordinates it.
The system supports real time data handling with a transmission speed of 1.16 Mbps, enabling advanced features such as data fusion with cameras and radar.
It also improves efficiency, using up to 50% less energy and reducing component weight by up to 50%. A new VASI interface allows flexible integration for vehicle manufacturers.
These developments support next generation driver assistance systems and contribute to the progress toward automated driving technologies.
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